eTraining Introduction How to Use This Module Introduction Choosing the Preparation Method Mount Fabrication Procedure Steel Etching Procedure Steel Polishing Procedure Rocks and Minerals Equipment Procedure Introduction Jet Spraying Lofting Suspension Odd Shapes - Fractures Cryo Fracture Technique Electronic Materials and Carbon Nanotubes Multiprep Polishing Procedure Handling Specimen Coating Reasons for Coating Metal Coating Procedure Carbon Coating Procedure Introduction Specimen Holders by Instrument Overview Interactive Parts Tour Operating Procedures Overview Chemicals and Materials Solution Preparation Chemical Calculations Fixation and Dehydration Mounting Safety and Disposal References Form and Function Signal Source and Detection Interactive Parts Tour Interactive Cutaway Tour Safety Procedures Operating Procedures Basic Imaging Advanced Imaging EDS X-Ray Spectral Analysis EDS X-Ray Mapping WDS Quantitative Analysis Procedure WDS X-Ray Mapping Overview WDS X-Ray Mapping Procedure Shut Down FAQs Troubleshooting VIDEO: Specimen Loading Technique VIDEO: Start Up Technique VIDEO: Specimen Unloading Technique Form and Function 1 Form and Function 2 Chemical Analysis Interactive Parts Tour Interactive Cutaway Tour Software Tour Safety Procedures Preliminary Specimen Exchange Flashing Imaging Shut Down Backscatter Imaging Charging Specimen Types X-Ray Spectral Analysis X-Ray Mapping Why Use FESEM? Specimen Constraints General FAQs Troubleshooting X-Rays and Spectra Energy Dispersive Spectrometer Wavelength Dispersive Spectrometer Safety Procedures EDS Versus WDS Quantitative X-Ray Microanalysis Basic Science Interactive X-Ray Mapping Challenge FAQs Troubleshooting Overview Tapping Mode Laser Alignment Preliminary Alignment Operation Image Viewing/Offline Operation Shut Down System Requirements Alternative Content Contact General Lab Safety Disclaimers Usage Permissions Site Map

Thin Sections

Equipment

RESIN INJECTOR
Logitech IU30

Logitech IU30 Impregnation Unit

About the IU30 Impregnation Unit - Logitech website

Geological Sciences - Thin Sections - Logitech website

    

GRINDERS
Dansk Beton Technic

Dansk-Beton Technic

Precision thin-section grinder for preparing thin sections of uniform thickness.

 Lapmaster 12

Lapmaster 12, Crane Packing Company

Lapping plate, compound agitator, compound valve, timer.

CUTTERS
Ingram 103

Ingram Labs Model 103 Ingram Laboratories Model 103

Thin section cut-off saw.

 Logitech CS 10

Logitech CS 10

Thin section cut-off saw.
Buehler Isomet 1000

Buehler Isomet 1000

Precision saw.

    

POLISHERS
Buehler Vibromet 1

Buehler Vibromet 1

Vibratory polisher.

 Buehler Ecomet 4

Buehler Ecomet 4

Variable speed grinder/polisher with Automet 2 power head.
LECO AP 50

LECO AP-50 Automatic Polishing Machine

 LECO AP 300

LECO AP-300 Automatic Polishing Machine

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