eTraining Introduction How to Use This Module Introduction Choosing the Preparation Method Mount Fabrication Procedure Steel Etching Procedure Steel Polishing Procedure Rocks and Minerals Equipment Procedure Introduction Jet Spraying Lofting Suspension Odd Shapes - Fractures Cryo Fracture Technique Electronic Materials and Carbon Nanotubes Multiprep Polishing Procedure Handling Specimen Coating Reasons for Coating Metal Coating Procedure Carbon Coating Procedure Introduction Specimen Holders by Instrument Overview Interactive Parts Tour Operating Procedures Overview Chemicals and Materials Solution Preparation Chemical Calculations Fixation and Dehydration Mounting Safety and Disposal References Form and Function Signal Source and Detection Interactive Parts Tour Interactive Cutaway Tour Safety Procedures Operating Procedures Basic Imaging Advanced Imaging EDS X-Ray Spectral Analysis EDS X-Ray Mapping WDS Quantitative Analysis Procedure WDS X-Ray Mapping Overview WDS X-Ray Mapping Procedure Shut Down FAQs Troubleshooting VIDEO: Specimen Loading Technique VIDEO: Start Up Technique VIDEO: Specimen Unloading Technique Form and Function 1 Form and Function 2 Chemical Analysis Interactive Parts Tour Interactive Cutaway Tour Software Tour Safety Procedures Preliminary Specimen Exchange Flashing Imaging Shut Down Backscatter Imaging Charging Specimen Types X-Ray Spectral Analysis X-Ray Mapping Why Use FESEM? Specimen Constraints General FAQs Troubleshooting X-Rays and Spectra Energy Dispersive Spectrometer Wavelength Dispersive Spectrometer Safety Procedures EDS Versus WDS Quantitative X-Ray Microanalysis Basic Science Interactive X-Ray Mapping Challenge FAQs Troubleshooting Overview Tapping Mode Laser Alignment Preliminary Alignment Operation Image Viewing/Offline Operation Shut Down System Requirements Alternative Content Contact General Lab Safety Disclaimers Usage Permissions Site Map

Films

Electronic Materials and Carbon Nanotubes

This type of sample is imaged using the Hitachi S-4700 FE-SEM.

Plan View

There are two orientations for thin films examination: plan view and cross-section. Mounting for plan view is accomplished by a) trimming the substrate to fit the aluminum mount and b) attaching the film to the mount with carbon tape. Nanotubes on substrates are mounted in the same fashion. It is possible to coat non-conductive films, but the coating itself may be visible at very high magnification (100k x or higher). It is usually possible to image uncoated films and nanotubes in the FESEM. This requires using very low voltage and short working distances.

Cross-Section

Mounting for cross-sections first involves exposing the section. You can cleave, fracture or polish the edge depending on the goal of your study. See Cryo Fracture Technique under Specimen Preparation. Polishing is carried out on the MultiPrep™ System. See Multiprep Polishing Procedure under Specimen Preparation. There is a special FESEM holder for substrates that holds the edge in a vertical orientation. Be aware that the specimen + holder height matters with the FESEM.

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